f eatures ? wide capacitance range in a given size ? high performance to withstanding 5mm of substrate bending test guarantee ? reduction in pcb bend failure ? lead free terminations ? high reliability and stability ? rohs compliant ? halogen compliant a p plications ? high flexure stress circuit board ? dc to dc converter ? high voltage coupling/dc blocking ? back- lighting inverters ? snubbers in high frequency power convertors me ritek multilayer ceramic chip capacitors supplied in bulk or tape & reel package are ideally suitable for thick - film hybrid circuits and automatic surface mounting on any printed circuit boards, all of meritek's mlcc products meet rohs directive. st series use a special material between nickel - barrier and ceramic body. it provides excellent performance to against bending stress occurred during process and provide more security for pcb process. the nickel - barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. the nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature. p art n umber s ystem d imension st 0805 xr 104 k 101 meritek series size 0603 0805 1206 1210 1812 1825 2220 2225 dielectric code xr cg x7r cog(npo) capacitance code 8r2 101 223 104 pf 8.2 100 22000 100000 nf -- 0.1 22 100 uf -- -- 0.022 0.1 tolerance code tolerance code tolerance code tolerance b 0.1pf c 0.25pf d 0.5pf f 1% g 2% j 5% k 10% m 20% rated voltage ? 2 significant digits + number of zeros. code 101 201 251 501 631 100vdc 200vdc 250vdc 500vdc 630vdc size inch (mm) l(mm) w(mm) tmax(mm) m b min (mm) 0603(1608) 1.6 0.2 0.8 0.15 0.95 0.20 0805(2012) 2.1 0.2 1.25 0.2 1.45 0.30 1206(3216) 3.3 0.3 1.6 0.2 1.80 0.30 1210(3225) 3.3 0.4 2.5 0.4 2.90 0.30 1812(4532) 4.5 0.4 3.2 0.3 2.80 0.26 1825(4563) 4.6 0.3 6.3 0.4 2.80 0.26 2220(5750) 5.7 0.4 5.0 0.4 2.80 0.30 2225(5763) 5.7 0.4 6.3 0.4 2.80 0.30 soft termination multilayer ceramic chip capacitors rohs meritek st series rev.7
g eneral electrical data item characteristic dielectric npo x7r size 1206 0603,0805,1206,1210,1808,1812,1825,2 220,2225 capacitance range * 1.5pf to 220pf 100pf to 4.7uf capacitance tolerance c: 0.25pf @cap 5pf d: 0.5pf @5pf cap 10pf j: 5%, k: 10% @cap 10pf j: 5%, k: 10%, m: 20% rated voltage (wvdc) 100v, 200v, 250v, 500v, 630v tan g * q < 400+20c @cap<30pf q 1000 @cap 30pf q 2.5% insulation resistance at ur ** 10g or rxc 100- f whichever is smaller @ur=100~630v 10g @ur=1000~3000v 10g or rxc 500- f whichever is smaller operating temperature - 55 to +125 q c capacitance characteristic 30ppm 15% termination cu(or ag)/ni/sn (lead - free termination) *measured at the condition of 30 % ~70% related humidity. npo: apply 1.0 0.2vrms, 1.0mhz 10% for cap 1000pf and 1 .0 0.2vrms, 1.0khz 10% for cap>1000pf, 25 q c at ambient temperature x7r: apply 1.0 0.2vrms, 1.0khz 10%, at 25 q c ambient temperature **measured at 500vdc for 60sec, for ur > 500vdc s tructure meritek st series is added a special termination material ( ultra - buffer or anti - bend) between ceramic body and ni -barrier that can absorb mechanical stress to prevent bending crack occured. 100% sn external termination inner electrode cu or ag termination ultra-buffer ni-barrier 100% sn external termination rev.7
dielectric np0 size 1206 rated voltage (vdc) 100 200 250 500 630 0.5pf (0r5) 1.0pf (1r0) 1.2pf (1r2) 1.5pf (1r5) 1.8pf (1r8) 2.2pf (2r2) 2.7pf (2r7) 3.3pf (3r3) 3.9pf (3r9) 4.7pf (4r7) 5.6pf (5r6) 6.8pf (6r8) 8.2pf (8r2) 10pf (100) 12pf (120) 15pf (150) 18pf (180) 22pf (220) 27pf (270) 33pf (330) 39pf (390) 47pf (470) 56pf (560) 68pf (680) 82pf (820) 100pf (101) 120pf (121) 150pf (151) 180pf (181) 220pf (221) 270pf (271) 330pf (331) 390pf (391) 470pf (471) 560pf (561) 680pf (681) 820pf (821) 1,000pf (102) 1,200pf (122) 1,500pf (152) 1,800pf (182) 2,200pf (222) 2,700pf (272) 3,300pf (332) 3,900pf (392) 4,700pf (472) 5,600pf (562) 6,800pf (682) capacitance 8,200pf (822) soft termination multilayer ceramic chip capacitors rohs meritek st series c apacitance r ange rev.7
dielectric x7r size 0603 0805 1206 1210 rated voltage (vdc) 100 200 250 100 200 250 500 100 200 250 500 630 100 200 250 500 630 100pf (101) 120pf (121) 150pf (151) 180pf (181) 220pf (221) 270pf (271) 330pf (331) 390pf (391) 470pf (471) 560pf (561) 680pf (681) 820pf (821) 1,000pf (102) 1,200pf (122) 1,500pf (152) 1,800pf (182) 2,200pf (222) 2,700pf (272) 3,300pf (332) 3,900pf (392) 4,700pf (472) 5,600pf (562) 6,800pf (682) 8,200pf (822) 0.010 f (103) 0.012 f (123) 0.015 f (153) 0.018 f (183) 0.022 f (223) 0.027 f (273) 0.033 f (333) 0.039 f (393) 0.047 f (473) 0.056 f (563) 0.068 f (683) 0.082 f (823) 0.10 f (104) 0.12 f (124) 0.15 f (154) 0.18 f (184) 0.22 f (224) 0.27 f (274) 0.33 f (334) 0.39 f (394) 0.47 f (474) 0.56 f (564) 0.68 f (684) 0.82 f (824) 1.00 f (105) 1.20 f (125) 1.50 f (155) 1.80 f (185) capacitance 2.20 f (225) soft termination multilayer ceramic chip capacitors rohs meritek st series rev.7
dielectric x7r size 1812 1825 2220 2225 rated voltage (vdc) 100 200 250 500 630 100 200 250 500 630 100 200 250 500 630 100 200 250 500 630 100pf (101) 120pf (121) 150pf (151) 180pf (181) 220pf (221) 270pf (271) 330pf (331) 390pf (391) 470pf (471) 560pf (561) 680pf (681) 820pf (821) 1,000pf (102) 1,200pf (122) 1,500pf (152) 1,800pf (182) 2,200pf (222) 2,700pf (272) 3,300pf (332) 3,900pf (392) 4,700pf (472) 5,600pf (562) 6,800pf (682) 8,200pf (822) 0.010 f (103) 0.012 f (123) 0.015 f (153) 0.018 f (183) 0.022 f (223) 0.027 f (273) 0.033 f (333) 0.039 f (393) 0.047 f (473) 0.056 f (563) 0.068 f (683) 0.082 f (823) 0.10 f (104) 0.12 f (124) 0.15 f (154) 0.18 f (184) 0.22 f (224) 0.27 f (274) 0.33 f (334) 0.39 f (394) 0.47 f (474) 0.56 f (564) 0.68 f (684) 0.82 f (824) 1.0 f (105) 1. 2 f (1 2 5) 1.5 f (155) 1.8 f (185) 2.2 f (225) 2.7 f (275) 3.3 f (335) 3.9 f (395) capacitance 4.7 f (475) soft termination multilayer ceramic chip capacitors rohs meritek st series rev.7
paper tape plastic tape size thickness (mm) 7 reel 13 reel 7 reel 13 reel 0603 (1608) 0.80+0.15/-0.10 4k 15k 0.80+0.15/-0.10 4k 15k - - 1.250.10 - - 3k 10k 0805 (2012) 1.250.20 - - 3k - 0.800.10 4k 15k - - 0.950.10 - - 3k 10k 1.250.10 - - 3k 10k 1206 (3216) 1.600.20 - - 2k - 0.950.10 - - 3k 10k 1.250.10 - - 3k 10k 1.600.20 - - 2k - 2.00 0.20 - - 1k - 1210 (3225) 2.500.40 - - 1k - 1.250.10 - - 1k - 1.60 0.20 - - 1k - 2.000.20 - - 1k - 1812 (4532) 2.500.30 - - 0.5k 3k 1.600.20 - - 1k - 2.000.20 - - 1k - 1825 (4563) 2.500.30 - - 0.5k - 1.600.20 - - 1k - 2.000.20 - - 1k - 2220 (5750) 2.500.30 - - 0.5k - 2.000.20 - - 1k - 2225 (5763) 2.500.30 - - 0.5k - unit: pieces fig. 4 the dimension of reel size 0603, 0805, 1206, 1210 1812,1825 ,2220 ,2225 reel size 7 10 13 7 c 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 w 1 8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0 12.4+2.0/-0 a 178.00.10 250.01.0 330.01.0 178.00.10 n 60.01.0/-0 100.01.0 1001.0 80.01.0 p ackage d imension a nd q uantity soft termination multilayer ceramic chip capacitors rohs meritek st series rev.7
cardboard tape dimesio 1 6 embossed tape dimensions size 0603 0805 1206 1210 chip thickness 0.80+0.15/-0.10 0.80+0.15/-0.10 1.250.10 1.250.20 0.800.10 0.95 0.10 1.25 0.10 1.60 0.20 0.95 0.10 1.25 0.10 1.60 0.20 2.00 0.20 2.50 0.40 a 0 1.02+0.05/-0.10 1.500.10 <1.65 2.000.10 <2.00 <2.00 <3.05 <3.10 b 0 1.800.10 2.300.10 <2.40 3.500.10 <3.60 <3.70 <3.80 <4.00 t 0.970.05 0.950.05 0.230.05 0.950.05 0.230.05 0.230.05 0.230.05 0.230.05 k 0 - - <2.50 - <2.50 <2.50 <2.50 <3.50 w 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 p 0 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.100 4.000.10 10xp 0 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 p 1 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 p 2 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 d 0 1.550.05 1.550.05 1.500.10/-0 1.550.05 1.500.10/-0 1.500.10/-0 1.500.10/-0 1.500.10/-0 d 1 - - 1.000.10 - 1.000.10 1.000.10 1.000.10 1.000.10 e 1.750.05 1.750.05 1.750.10 1.750.10 1.750.10 1.750.10 1.750.10 1.750.10 f 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 size 1812 1825 2220 2225 chip thickness 1.25 0.10 1.60 0.20 2.00 0.20 2.50 0.30 1.60 0.20 2.00 0.20 2.50 0.30 1.60 0.20 2.00 0.20 2.50 0.30 2.00 0.20 2.50 0.30 a 0 <3.90 <3.90 <6.80 <6.80 <5.80 <5.80 <6.80 <6.80 b 0 <5.30 <5.30 <5.30 <5.30 <6.50 <6.50 <6.50 <6.50 t 0.250.05 0.25 0.05 0.300.10 0.300.10 0.300.10 0.300.10 0.300.10 0.300.10 k 0 <2.50 <3.00 <2.50 <3.10 <2.50 <3.10 <2.50 <3.10 w 12.00.20 12.0 0.20 12.00.20 12.00.20 12.00.20 12.00.20 12.00.20 12.00.20 p 0 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 10xp 0 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 40.000.20 p 1 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 p 2 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 d 0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 d 1 1.500.10 1.50+/-0.10 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 e 1.750.10 1.75+/-0.1 1.750.1 1.750.10 1.750.1 1.750.10 1.750.10 1.750.10 f 5.500.05 5.50+/-0.05 5.500.05 5.500.05 5.500.05 5.500.05 5.500.05 5.500.05 fig. 2 the dimension of paper tape fig. 3 the dimension of plastic tape soft termination multilayer ceramic chip capacitors rohs meritek st series rev.7
storage to prevent the damage of solderability of terminations, the following storage conditions are recommended: indoors under 5 ~ 40 and 20% ~ 70% rh. no harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine. packaging should not be opened until the capacitors are required for use. if opened, the pack should be re-sealed as soon as is practicable. taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesion performance. the capacitors should be used within 6 months and checked the solderability before use. handling chip capacitors are dense, hard, brittle, and abrasive materials. they are liable to suffer mechanical damage, in the form of cracks or chips. chip capacitors should be handled with care to avoid contamination or damage. to use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual placement. tape and reeled packages are suitable for automatic pick and placement machine. preheat in order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required. the rate of preheat should not exceed 4 per second and the final preheat temperature should be within 100 of the soldering temperature for small chips such as 0603, 0805 and 1206, within 50 of the soldering temperature for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. soldering use middy activated rosin ra and rma fluxes do not use activated flux. the amount of solder in each solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between solder, chips, and substrate. hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2 mm is recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron should be set to not more than 260 . for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. wave soldering and hand soldering are no recommended. recommended soldering profiles as following: soldering solder temp.(t) soldering time (t) reflow 235 C 260 < 15 sec. wave 230 C 260 < 5 sec. chip size t 0603, 0805, 1206 100 1210, 1808, 1812, 1825, 2220, 2225 50 cooling after soldering, cool the chips and the substrate gradually to room temperature. natural cooling in air is recommended to minimize stress in the solder joint. a cooling rate not exceeding 4 per second should be used when forced cooling is necessary. cleaning all flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could cause electrolytic surface corrosion. good results can be obtained by using ultrasonic cleaning of the solvent. the choice of the proper system is depends upon many factors such as component mix, flux, and solder paste and assembly method. the ability of the cleaning system to remove flux residues and contamination from under the chips is very important. preheat soldering cooling t 60 sec. t 120 sec . 100 200 ( ) soft termination multilayer ceramic chip capacitors rohs meritek st series a pplication n otes rev.7
no. item test condition requirements 1. visual and mechanical --- * no remarkable defect. * dimensions to conform to individual specification sheet. 2. capacitance * shall not exceed the limits given in the detailed spec. 3. q/ d.f. (dissipation factor) class i: (np0) cap 1000pf, 1.00.2vrms, 1mhz10% cap>1000pf, 1.00.2vrms, 1khz10% class ii: (x7r) 1.00.2vrms, 1khz10% np0: cap 30pf, q 1000; cap<30pf, q 400+20c x7r: 2.5% 4. temperature coefficient with no electrical load. t.c. operating temp np0 -55~125c at 25c x7r -55~125c at 25c t.c. capacitance change npo within 30ppm/c x7r within 15% 5. insulation resistance u r =100v: to apply voltage at u r for max. 120 sec. u r >100v: to apply voltage at u r (500v max.) for 60 sec. class i (np0) : 100g or rxc 1000 -f whichever is smaller. class ii (x7r) : 10g or rxc 500 -f whichever is smaller. 6. dielectric strength * to apply voltage: 100v =2.5 times of u r 200v/250v =2 times of u r 500v =1.5 times of u r > 500v =1.2 times of u r * duration: 1 to 5 sec. * no evidence of damage or flashover during test. 7. solderability * solder temperature: 2355c * dipping time: 20.5 sec. npo: 95% min. coverage of all metalized area. x7r:75% min. coverage of all metalized area. 8. resistance to soldering heat * solder temperature: 2605c * dipping time: 101 sec * preheating: 120 to 150c for 1 minute before immerse the capacitor in a eutectic solder. * before initial measurement : perform 150+0/-10c for 1 hr and then set for 484 hrs at room temp. * measurement to be made after keeping at room temp. for 24 2hrs (class i) or 484 hrs (class ii) * no remarkable damage. * cap change: np0: within 2.5% or 0.25pf whichever is larger. * q/d.f., i.r. and dielectric strength: to meet initial requirements. x7r: within 15% * 25% max. leaching on each edge. 9. temperature cycle * conduct the five cycles according to the temperatures and time. step temp. (c) time (min.) 1 min. operating temp. +0/-3 303 2 room temp. 2~3 3 max. operating temp. +3/-0 303 4 room temp. 2~3 * before initial measurement : perform 150+0/-10c for 1 hr and then set for 484 hrs at room temp. * measurement to be made after keeping at room temp. for 242 hrs. (class i) or 484 hrs (class ii) * no remarkable damage. * cap change np0: within 2.5 or 0.25pf whichever is larger. x7r: within 15% * q/d.f.: x7r: 1.5 initial requirement * i.r. 0.25 initial requirements. 10. humidity (damp heat) steady state * test temp.: 402c * humidity: 90~95% rh * test time: 500+24/-0hrs. * measurement to be made after keeping at room temp. for 242 hrs. (class i) or 484 hrs (class ii) * no remarkable damage. * cap change: np0: within 5.0% or 0.5pf whichever is larger. x7r :within 15% q/d.f value: np0: cap 30pf, q 350; 10pf cap<30pf, q 275+2.5c cap<10pf; q 200+10c x7r: 7.0% * i.r.: 1g or rxc 50 -f whichever is smaller. soft termination multilayer ceramic chip capacitors rohs meritek st series r eliability t est c ondition s and r equirements rev.7
no. item test condition requirements 11. humidity (damp heat) load * test temp.: 402c * humidity: 90~95%rh * test time: 500+24/-0 hrs. * to apply voltage rated voltage (max. 500v) * measurement to be made after keeping at room temp. for 242 hrs. (class i). * no remarkable damage. * cap change: np0: within 7.5% or 0.75pf whichever is larger. * q/d.f. value: np0: cap 30pf, q 200; cap<30pf, q 100+10/3c * i.r.: 500m or rxc 25 -f whichever is smaller. 12. vibration resistance * vibration frequency: 10~55 hz/min. * total amplitude: 1.5mm * test time: 6 hrs. (two hrs each in three mutually perpendicular directions.) * no remarkable damage. * cap change and q/d.f.: to meet initial spec. 13. high temperature load (endurance) * test temp.: 1253c * to apply voltage: (1) u r 250v: 200% of rated voltage. exception item: to apply 150% of rated voltage u r size cap. range 100v 1206 1210 > 224 1210 > 224 1812 > 474 1825 > 105 2220 > 105 200v / 250v 2225 > 105 (2) 250 < u r 500v: 150% of rated voltage. (3) u r > 500v: 120% of rated voltage. * test time: 1000+24/-0 hrs. * measurement to be made after keeping at room temp. for 242 hrs. (class i) or 484 hrs (class ii) * no remarkable damage. * cap change: np0: within 3.0% or 0.3pf whichever is larger. x7r :within 15% * q/d.f value: np0: cap 30pf, q 350 10pf cap<30pf, q 275+2.5c cap<10pf, q 200+10c x7r: 7.0% * i.r.: 1g or rxc 50 -f whichever is smaller. 14. resistance to flexure of substrate * the middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1mm per second until the deflection becomes 5mm . * no remarkable damage. * cap change: x7r: within 10% (this capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 15. adhesive strength of termination * capacitors mounted on a substrate. a force of 10n applied perpendicular to the place of substrate and parallel the line joining the center of terminations for 10 1 second. * no remarkable damage or removal of the terminations. r = 230 20 50 45 1 45 1 5mm capacitor pc board 10n soft termination multilayer ceramic chip capacitors rohs meritek st series rev.7
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